Lateral shift measurement using an optical technique

ABSTRACT

Alignment of layers during manufacture of a multi-layer sample is controlled by applying optical measurements to a measurement site in the sample. The measurement site includes two diffractive structures located one above the other in two different layers, respectively. The optical measurements include at least two measurements with different polarization states of incident light, each measurement including illuminating the measurement site so as to illuminate one of the diffractive structures through the other. The diffraction properties of the measurement site are indicative of a lateral shift between the diffractive structures. The diffraction properties detected are analyzed for the different polarization states of the incident light to determine an existing lateral shift between the layers.

FIELD OF THE INVENTION

This invention is generally in the field of manufacturing of multi-layerstructures, such as semiconductor wafers and integrated circuits, andrelates to an optical measuring method and system for control of layersalignment.

BACKGROUND OF THE INVENTION

Integrated circuits are multi-layer structures produced by applying asequence of deposition-lithography-etching steps to a semiconductorwafer. In such structures layers have to be precisely aligned with eachother, which is controlled by the so-called “overlay measurement”. Thismeasurement is usually accomplished using a box-within-a-box techniqueconsisting of the following. A rectangular frame-like structure isformed in a test site of each layer, and two adjacent layers areconsidered as being correctly aligned if a specific alignment betweenthe frames on these layers is provided. Overlay defining the alignmentis measured by comparing the shifts between the frames at oppositesides: determining whether the frames are precisely concentric, thesmaller frame being inside the larger one (in projection).

The above technique is carried out by an ordinary optical microscope,which is capable of measuring line width with a resolution limited byresolution of optical imaging systems, usually not less than severalnanometers. The current high-performance semiconductor devices, however,have features' dimensions of 0.13 μm and less, and require measurementsof overlay registration with the resolution of less than 1 nm.

A different alignment technique is disclosed in the U.S. Pat. No.5,216,257. According to this technique, two grating structures ofdifferent periodicity are deposited on two adjacent layers in amulti-layer structure, and a change in a moire fringe pattern caused bythe superposition of two gratings is detected, being indicative of agrating alignment error.

SUMMARY OF THE INVENTION

There is a need in the art to facilitate overlay measurements for thepurpose of correct alignment of layers in a multi-layer sample (e.g.,integrated circuit), by providing a novel optical method and system.

The main idea of the present invention is based on the fact that thediffraction of incident radiation from a pair gratings (or any otherdiffractive structures), located one on top of the other is affected byall geometrical aspects of the gratings, namely, both the parameters ofeach separate grating and their location relative to each other (i.e.,lateral shift). According to the present invention, the lateral shiftbetween two layers is determined by analyzing electromagnetic radiation(light) diffracted from gratings (patterned structure) of substantiallythe same periodicity, which are specifically arranged within a siteformed by regions of two layers. To this end, scatterometry (measuringdiffraction efficiency as a function of wavelength and/or angle ofincidence) or ellipsometry (measuring both change of polarizationamplitude and phase of the diffracted light) can be utilized. Thesetechniques are based on the detection of the so-called “diffractionsignature” of two gratings one on top of the other.

Thus, according to the invention, an effect of radiation diffractionfrom two patterned structures (gratings) of known periodicity locatedone on top of the other, caused by a lateral shift between the twopatterned structures, is detected and analyzed to determine an alignmenterror. The patterned structures are located within a site formed by tworegions of two layers, respectively. Preferably, two patternedstructures (gratings) of substantially the same periodicity are used.

According to different embodiments of the invention, the followingmethods are used: a so-called “direct method”, a method based onreference sites, and a method based on simple calibration. The directmethod is based on the initial calculations of a diffraction signatureusing certain well-defined models. The reference sites method is basedon the comparison between diffraction signatures measured in differentsub-regions of the site. The simple calibration based method utilizescertain reference data previously obtained by any suitable tool to beindicative of various diffraction signatures corresponding to respectivelateral shifts. These different methods require different sites preparedon the layers of a multi-layer sample.

The term “site” used herein signifies a location in a multi-layer samplethat includes two regions one on top of the other. Such a site may be atest site located outside the features containing area if a sample.

If layers' shift along more than one axis in the sample plane is to bedetermined, the test site (generally, grating containing site) includestwo main regions, one containing a grating structure aligned along theX-axis of the sample and the other along the Y-axis of the sample. Eachregion may contain several different sub-regions having differentnominal shifts between the gratings. The term “nominal” signifies ashift of the masks used for layer manufacturing, assuming perfect masksproduction and zero alignment error.

Another embodiment of the test structure may contain a two-dimensionalgrating enabling the measurement of the X and the Y components of thelateral shift at the same site. In order to avoid the possibility toconfuse between the X and the Y components several methods may be used:(a) Produce a test site whose period in the Y-axis is significantlydifferent than the period in the X-axis (b) measure the same siteseveral times using different polarizations (in case of polarizedreflectometry) (c) measure the same site from different directions. Allthe above methods result in different changes to the diffractionsignatures due to shifts in different directions, thus avoidingconfusion.

According to another embodiment of the test structure, the diffractivestructures of one of at least two pairs are shifted with respect to eachother along the X-axis by a distance +ΔX and the diffractive structuresof the other of the at least two pairs are shifted with respect to eachother along the X-axis by a distance (−ΔX).

According to another embodiment of the test structure, the diffractivestructures of one of the at least two pairs are shifted with respect toeach other along the X-axis by a distance (+ΔX), and the diffractivestructures of the other of the at least two pairs are shifted withrespect to each other along the X-axis by a distance (−ΔX±NΔx), whereΔx<<ΔX and N is an integer number.

According to another embodiment of the test structure, the twodiffractive structures of at least one pair have patterns of features ofdifferent periodicities.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to understand the invention and to see how it may be carriedout in practice, a preferred embodiment will now be described, by way ofnon-limiting example only, with reference to the accompanying drawings,in which:

FIG. 1 is a schematic illustration of a cross-section of a site in asemiconductor wafer;

FIGS. 2A and 2B illustrate the principles of a direct method accordingto the invention;

FIG. 2C shows diffractive structures having two-dimensional patterns offeatures.

FIG. 3 illustrates the principles of a reference sites based methodaccording to the present invention;

FIGS. 4-6 illustrate different simulation results of the sensitivitytest as functions of grating parameters; and

FIG. 7 illustrates the effect of an overlay error on a scatterometrysignal (diffraction efficiency) as measured on the optimal structure.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIG. 1, there is schematically illustrated a cross-sectionof a test site 10 in a semiconductor wafer suitable for use in thepresent invention. The site 10 contains two gratings (patternedstructures) 12 and 14 of certain known periodicity located one above theother. In the present example, the gratings 12 and 14 have substantiallythe same period P. In the present example, the top grating 12 presents apattern of spaced-apart photoresist-containing regions R_(PR), and theunderneath grating 14 presents a pattern of spaced-apartaluminum-containing region R_(Al). In this specific example, thegratings 12 and 14 have different duty cycles defined by featurescritical dimensions CD_(PR) and CD_(AL), respectively. It should,however, be noted that this condition is not a requirement for thetechnique of the present invention, but provides for a bettersensitivity of the method. As further shown in the figure, the gratings12 and 14 are shifted along the X-axis with respect to each other adistance S, which is measured as a distance between the centers of thetwo locally adjacent regions (lines) R_(PR) and R_(Al).

In order to find the conditions under which the method of the presentinvention is most effective, and show how the method is practical, thesensitivity of the method has been studied for a specific configurationof the site structure exemplified in FIG. 1. The site structure 10 istypical for the overlay problem in photoresist-on-aluminum layerstructure. The pattern in the aluminum (Al) layer is typically definedby layers underneath the aluminum layer, and the photoresist (PR) layeris patterned by a lithography processing. In this specific example, thePR lines are modeled to be on top of the Al lines. It should, however,be understood, that this is not essential for the present invention, andPR lines may be located between the Al lines, as well. For simplicity,both gratings 12 and 14 have a square profile. The measurement techniqueused for this analysis is the normal incidence polarizedspectrophotometry. According to this technique, the normal incidencereflectivity spectrum is measured with selective polarization directionof the incident light relative to the grating (TM polarization mode inthis specific example). Other optical techniques, such as spectralellipsometry, angular scatterometry, etc. may be used as well.

The sensitivity of the spectrum (measured by the technique of thepresent invention, which will be described more specifically furtherbelow) to a change in the lateral shift S between the gratings 12 and 14has been studied. The ratio between the mean change in the spectrum(defined as the root of the mean of the square differences betweenspectra with and without a change in the shift) caused by a change inthe shift value S of 1 nm has been defined as the sensitivity test T,wherein S is the nominal shift.

The simulation results have shown that T depends on all the parametersof the test structure. Values of T are almost always monotonouslyincreasing with the values of S. This general rule holds as much as Tcan be increased, i.e., until the edge of the PR line “falling off” fromthe Al line. It is thus evident that the measurement is more sensitivefor an asymmetrical structure.

As for the other parameters of the test site, such as the period P, theCD_(PR) and CD_(Al) (generally, the duty cycles of gratings) and theheights H_(PH) and H_(Al) of the two gratings, they usually affect thesensitivity test T in an oscillatory manner. It is thus necessary tofind such a set of gratings parameters, that T is maximized while beingleast sensitive to the exact values of these parameters. For example,the value of T equal to 8·10⁻³ is obtained with the following set ofgratings' parameters: P=600 nm, CD_(PR)=300 nm, CD_(AL)=150 nm,H_(PR)=600 nm, and H_(AL)=100 nm.

In one embodiment of the invention, the direct method is used. In thismethod exact simulation methods, such as RCWT (Rigorous Couple WaveTheory), are used to simulate the diffraction signature(s) from the testsite. In the simplest case there is not any prior knowledge of the exactgrating properties on either layers. In this case the experimentallymeasured diffraction from the test site is fitted to simulation fittingat the same time for both CD's, grating heights and additionalparameters characterizing the individual gratings in the two layers andthe shift as an additional fitting parameter.

FIGS. 2A and 2B exemplify the principles underlying the design of a testsite 20 suitable to be used for another embodiment of the presentinvention. FIG. 2C illustrates diffractive structures havingtwo-dimensional patterns of features. The test site 20 is formed byregions 24 and 26 located one on top of the other in layers L₁ and L₂,respectively. As shown in FIG. 2B, the two regions 24 and 26 definetogether four different pairs of sub-regions: A₁-A₂, B₁-B₂, C₁-C₂ andD₁-D₂, wherein sub-regions A₂, B₂, C₂ and D₂ are located on top ofsub-regions A₁, B₁, C₁ and D₁, respectively. In the pair A₁-A₂,sub-regions A₁ and A₂ are different in that region A₁ contains a gratingG_(Al) and sub-region A₂ has no grating at all, and in the pairD₁-D₂—vice versa. Gratings G_(B1) and G_(B2) of sub-regions B₁ and B₂,respectively, are shifted with respect to each other along the X-axis adistance +Δx (i.e., in the positive X-direction), and gratings G_(C1)and G_(C2) are shifted with respect to each other a distance −Δx(negative X-direction). In this embodiment information is gained frommeasuring the single-grating sites (sub regions A₁-A₂ and D₁-D₂) inorder to simplify the fitting in the dual-grating sites (sub regionsB₁-B₂ and C₁-C₂). The measurement is done in two steps. In the firststep the single-grating sites are measured and the gratingcharacteristics in those sites, including for example CD, height wallangle etc., are measured by fitting to simulation, as in normalscatterometry. In the second step the measurements of the dual-gratingsites are fitted to simulation using all or part of the gratingparameters that have been measured in Step 1 and fitting for the shiftbetween the gratings. It should be noted that at least those gratingswhich are located in a common layer must be are identical, i.e., havethe same period, duty cycle, and height.

Notice that for the case of perfect alignment the measurements of sitesB and C should be identical, thus a significant difference between thetwo measurements may indicate an alignment error. The difference betweenthe two signals obtained from sub-region pairs B₁-B₂ and C₁-C₂,respectively, may be utilized in order to increase the sensitivity andreduce systematic measurement errors. This can be done by fitting thedifference of simulated signatures to the difference of the measurementsin the two sites. This procedure may be used in order to filter outchanges in the spectrum that are not related to the shift S, thusenhancing the sensitivity and the robustness of the measuring technique.

In another embodiment of the invention, the reference site method isused. FIG. 3 illustrates the main principles underlying this method.Here, a test site 30, which is formed by two regions one above the otherin layers L₁ and L₂, is composed of a so-called “measurement site” 32and a so-called “reference site” 34 spaced-apart from each other alongthe X-axis. Gratings in these sites are not specifically illustrated,but is should be understood that both the measurement and the referencesites include sub-region pairs arranged as described above. In thismethod, the measurement site 32 has one grating-pair characterized by anominal shift (+ΔX) between the gratings, and the reference site 34 hasseveral grating-pairs located in sub-region pairs, respectively, alignedin a spaced-apart relationship along the X-axis and characterized by thefollowing nominal shifts: −ΔX−3Δx, −ΔX−2Δx, −ΔX−Δx, −ΔX, −ΔX+Δx,−ΔX+2Δx, −ΔX+3Δx, . . . etc., Δx is typically much smaller than ΔX andis of the same order of magnitude as the required resolution in thelateral shift measurement. In this method, it is assumed that thegrating profiles are sufficiently symmetric and unaffected by the ex actshift, and therefore symmetric shifts between the gratings (uppergrating shifted to either right or left of the lower grating) willresult in the identical diffraction signatures.

When the two layers are printed with an alignment error (+ξ), the actualshifts between the gratings of the measurement site will be: (+ΔX+ξ) andfor the reference sites the shifts will be as follows(−ΔX−3Δx+ξ);(−ΔX−2Δx+ξ);(−ΔX−Δx+ξ);(−ΔX+ξ);(−ΔX+Δx+ξ);(−ΔX+2Δx+ξ); etc.

In order to measure the alignment error 4, the diffraction signaturesfrom all the sub-region pairs are measured using one of the abovementioned measurement techniques. Then, the signature from themeasurement site is compared to the signatures from all the sub-regionpairs in the reference site, looking for the best match. If the bestmatch is found for the (+N)′^(th) sub-region pair, for which the nominalshift is (−ΔX+NΔx), than we have:(+ΔXr+ξ)≈−(−ΔXr+NΔx+ξ)and therefore:ξ≈(−NΔx)/2

Hence, the shift with the resolution of Δx/2 can be found by simplyfinding the best matching signature from the set.

If a significant range of shifts is to be covered by a small number ofsub-region pairs in the reference site, Δx should be selected to besignificantly larger than the required resolution. In this case, someinterpolation method can be used in order to find the shift withimproved accuracy. Interpolation can be done, for example, bycalculating the RMS (root mean square) of the difference between themeasurement site signature and all reference site signatures, fittingall or part of the results to a polynomial function of the shift andfinding the shift providing minimum RMS difference in signatures.Another optional interpolation method is using a learning system, whichis trained using the reference site data to return the shift, andmeasurement site data is used as input for interpretation. Comparing thereference site method to the direct method, the reference site method isadvantageously self-calibrating, i.e., there is no need to realize thepotentially complex details about how the diffraction signature wascreated, including materials properties and exact geometry (e.g. CD,line profile), as long as these are constant for all involved sites. Thereference site method, however, requires a larger area on the sampleoccupied by a test site and a larger number of measurements, requiringmore time.

In yet another embodiment of the invention, a calibration method may beused. In this method, a test site similar to the test site 20 of FIGS.2A and 2B (suitable to be used for direct method) but including only twograting-containing sub-region pairs B₁-B₂ and C₁-C₂ is used. Here,similarly to the direct method, the difference between the diffractionsignatures measured on both sub-region pairs is determined, but, indistinction to the direct method, the resulting signature is not fittedto a theoretical signature, but is rather interpreted using a previouslyperformed calibration stage. In the calibration stage, the signature (oronly some sensitive e points thereof) is determined as a function ofalignment error values, being measured by a suitable reference tool(e.g., ordinary microscope). To this end, a test sample (e.g.,semiconductor wafer) is specifically prepared with several alignmentshifts, and measured off-line to make a record of the calibrationresults and keep it as reference data.

In accordance with still another embodiment of the test structure maycontain a two-dimensional grating enabling the measurement of the X andthe Y components of the lateral shift at the same site. In that case, inorder to avoid the possibility to confuse between the X and the Ycomponents further several methods may be used. In accordance with oneembodiment, test site is prepared, comprising two dimension grating witha period in the Y-axis significantly different than the period in theX-axis. In accordance with another embodiment polarized reflectometrytechnique may be used to measure the same site several times withdifferent polarizations. Finally, the same site may be measured fromdifferent directions (with different orientation). All the above methodsresult in different changes to the diffraction signatures due to shiftsin different directions, thus avoiding confusion.

Reference is now made to FIGS. 4-6 showing different simulation resultsof the sensitivity test as functions of grating parameters. FIG. 4illustrates the sensitivity test as a function of Al grating depth(H_(Al)) and shift S using the test structure of FIG. 1 with thefollowing parameters: CD_(PR)=150 nm, CD_(Al)=300 nm, P=800 nm andH_(PR)=600 nm. FIG. 5 illustrates the sensitivity test as a function ofAl grating depth (H_(Al)) and grating period P using the test structureof the following parameters: CD_(PR)=150 nm, CD_(Al)=300 nm, H_(PR)=600nm and S=75 nm. FIG. 6 illustrates the sensitivity test as a function ofAl grating depth using the test structure of the following parameters:CD_(PR)=150 nm, CD_(Al)=300 nm, P=600 nm and H_(PR)=600 nm. Two graphsR1 and R2 are shown corresponding, respectively, to TM and TEpolarization modes of incident radiation relative to the gratingorientation.

FIG. 7 illustrates the effect of a 5 nm overlay error on a scatterometrysignal (diffraction efficiency) measured on the optimal structure withthe TM polarization mode. Two diffraction signatures SG₁ and SG₂ areshown corresponding, respectively, to a sample with no lateral shiftbetween the layers (i.e., overlay is zero) and to a sample with a 5 nmoverlay error.

Obviously, many modifications and variations of the present inventionare possible in the light of the above teachings. For example, in thereference site based method grating-pairs located in sub-region pairsmay be characterized by pre-determined arbitrary nominal shifts.

Those skilled in the art will readily appreciate that many modificationsand changes may be applied to the invention as hereinbefore exemplifiedwithout departing from its scope, as defined in and by the appendedclaims.

What is claimed is:
 1. A structure configured for overlay measurement ona multi-layer sample, said structure comprising first and second testsites, each comprising a pair of diffractive structures of predeterminedgeometries located in different layers one above the other, wherein eachof the diffractive structures comprises a pattern of features aligned ina spaced-apart relationship along at least one X-axis and Y-axis, thetwo diffractive structures in each of said first and second test sitesare arranged with a predetermined lateral shift between the patterns insaid diffractive structures, such that the diffractive structures in thefirst test site are arranged with a lateral shift of a predeterminedvalue Δ in a first direction along one of said X-axis and Y-axes, andthe diffractive structures in the second test site are arranged with alateral shift of said value Δ along said one of the X- and Y-axes in asecond opposite direction; a difference between first and secondmeasured diffraction signatures from the first and second test sites,respectively, providing an overlay measurement indicative of a lateralshift between said layers in the sample.
 2. The structure according toclaim 1, wherein the patterns of features in said diffractive structureshave same periodicity.
 3. The structure according to claim 1, whereinthe diffractive structures of the pair located in a top layer of saiddifferent layers comprise the patterns of features formed byspaced-apart photoresist-containing regions, and the diffractivestructures of the pair located in an underneath layer of said differentlayers comprise the patterns of features formed by spaced-apartaluminum-containing regions.
 4. A multi-layer sample comprising a teststructure configured as the structure of claim
 1. 5. A semiconductorwafer sample comprising a test structure configured as the structure ofclaim
 1. 6. The structure according to claim 1, wherein the diffractivestructures of the first and second test sites in the different layerscomprise the patterns of features of different first and secondmaterials, respectively.
 7. A method for use in overlay measurements ofa lateral shift between layers in a patterned region of a multi-layersample, the method comprising: during manufacture of the patternedregion in the sample, creating at least one test structure located inthe sample outside said patterned region, and being configured as thestructure of claim 1 with the predetermined intentionally inducedlateral shift between the first and second test sites; such that alateral shift between the layers in the patterned region introduced asan error in the manufacture of the sample is identifiable as adifference between diffraction signatures measured from the first andsecond test sites enhanced by said intentionally induced lateral shiftbetween the first and second test sites.
 8. The structure according toclaim 6, wherein each of the diffractive structures of the pair locatedin a top layer of said different layers comprises the pattern offeatures formed by spaced-apart photoresist-containing regions.
 9. Thestructure according to claim 8, wherein each of the diffractivestructures of the pair located in an underneath layer of said differentlayers comprises the pattern of features formed by spaced-apart metalregions.
 10. The method according to claim 7, wherein the diffractionsignature is formed by electromagnetic radiation diffracted from thepattern of features in the respective diffractive structure.
 11. Themethod according to claim 10, wherein said electromagnetic radiation isoptical radiation.
 12. The method according to claim 7, wherein saidmulti-layer sample is a semiconductor wafer.
 13. A multi-layer samplecomprising at least one test structure configured for overlaymeasurement in said sample, the test structure comprising first andsecond test sites, each comprising a pair of diffractive structures ofpredetermined geometries located in different layers one above the otherin said sample, each of the diffractive structures comprising a patternof features aligned in a spaced-apart relationship along at least oneX-axis and Y-axis, wherein the two diffractive structures in each ofsaid first and second test sites are arranged with a predeterminedlateral shift between the patterns in said diffractive structures, suchthat the diffractive structures in the first test site are arranged witha lateral shift of a predetermined value Δ in a first direction alongone of said X-axis and Y-axes, and the diffractive structures in thesecond test site are arranged with a lateral shift of said value Δ alongsaid one of the X- and Y-axes in a second opposite direction, adifference between first and second measured diffraction signatures fromthe first and second test sites, respectively, providing an overlaymeasurement of a lateral shift between said layers in the sample. 14.The multi-layer sample according to claim 13, comprising a patternedregion, said at least one test structure being located outside saidpatterned region and being configured for the overlay measurements tocorrect alignment of the layers of the sample within said patternedregion.
 15. The multi-layer sample according to claim 13, being asemiconductor wafer.